Bahagian Hal Ehwal Pelajar dan Alumni (BHEPA) ingin memaklumkan bahawa permohonan bagi K-Youth Development Programme kini dibuka kepada graduan yang memenuhi syarat kelayakan.

Program inisiatif kebolehpasaran belia ini bertujuan untuk memperkasakan bakat muda Malaysia melalui latihan pembangunan kemahiran, pendedahan industri serta penempatan pekerjaan dalam sektor semikonduktor.

Kelayakan Permohonan

• Memiliki Ijazah dalam bidang Semikonduktor.
• Berumur tidak melebihi 30 tahun.
• Tidak pernah menyertai program pekerjaan yang seumpamanya.
• Sedang menganggur.

Manfaat Program

• Elaun bulanan sehingga RM2,500 (termasuk caruman EPF dan SOCSO).
• Latihan kemahiran insaniah dan persediaan memasuki alam pekerjaan.
• Penempatan di syarikat-syarikat semikonduktor terkemuka.
• Pengalaman kerja secara langsung melalui tugasan dan projek industri.
• Pensijilan profesional daripada CompTIA.
• Manfaat perubatan termasuk rawatan pesakit luar dan perlindungan kemasukan ke hospital.

Graduan yang berminat dan memenuhi syarat kelayakan adalah digalakkan untuk memohon. Sila imbas kod QR pada poster untuk maklumat lanjut dan pendaftaran program.

Rebut peluang ini untuk meningkatkan kebolehpasaran diri, memperoleh pengalaman industri yang bernilai dan memulakan kerjaya dalam sektor semikonduktor yang semakin berkembang.

BAHASA ENGLISH

The Student Affairs and Alumni Department (BHEPA) is pleased to announce that applications for the K-Youth Development Programme are now open to eligible graduates.

The programme is a youth employability initiative designed to empower young talents through industry-relevant training, workforce readiness development, and job placement opportunities within the semiconductor sector.

Eligibility Requirements

• Possess a Degree in Semiconductor or a related field.
• Aged 30 years and below.
• Have not participated in similar employment programmes.
• Currently unemployed.

Programme Benefits

• Monthly allowance of up to RM2,500 (inclusive of EPF and SOCSO contributions).
• Soft skills and workforce readiness training.
• Placement opportunities with leading semiconductor companies.
• Hands-on work experience through industry projects and assignments.
• Professional certification from CompTIA.
• Medical benefits, including outpatient treatment and hospitalisation coverage.

Eligible graduates are encouraged to seize this opportunity to enhance their employability, gain valuable industry exposure, and build a rewarding career in the growing semiconductor industry.

For further information and application details, please scan the QR code provided on the poster and submit your application before the closing date, if applicable.

Permohonan Biasiswa GXBank Impian Gigih Pengambilan Ke-3 Kini Dibuka

Sukacita dimaklumkan bahawa permohonan bagi Program Biasiswa GXBank Impian Gigih Pengambilan Ke-3 kini dibuka kepada pelajar yang bakal memulakan pengajian Ijazah Sarjana Muda.

Program biasiswa ini menawarkan sokongan menyeluruh kepada penerima yang berjaya, termasuk:

• Sokongan matrikulasi
  • Pembiayaan penuh yuran pengajian
  • Elaun sara hidup dan penginapan
  • Program pembelajaran dan pembangunan diri
  • Peluang menyertai program pendedahan di luar negara

Pelajar yang mempunyai pencapaian akademik cemerlang, kepimpinan yang baik serta komitmen terhadap pembangunan diri adalah digalakkan untuk memohon.

📅 Tarikh tutup permohonan: 6 Julai 2026

Untuk maklumat lanjut dan permohonan, sila imbas kod QR pada poster atau layari pautan yang disediakan oleh pihak penganjur.

Rebut peluang ini untuk merealisasikan impian akademik dan membina masa depan yang lebih gemilang bersama GXBank.

BAHASA ENGLISH

GXBank Impian Gigih Scholarship Programme – 3rd Intake Now Open

Applications for the GXBank Impian Gigih Scholarship Programme (3rd Intake) are now open to students who are entering their first year of undergraduate studies.

This scholarship programme provides comprehensive support to successful recipients, including:

• Matriculation support
  • Full tuition fee sponsorship
  • Living and accommodation allowance
  • Learning and development programmes
  • Overseas exposure opportunities

Students with outstanding academic achievements, strong leadership potential, and a passion for personal growth are encouraged to apply.

📅 Application Deadline: 6 July 2026

For more information and application details, please scan the QR code on the poster or visit the official application page.

HEBAHAN PERMOHONAN BIASISWA DAN BANTUAN PENDIDIKAN KUOK FOUNDATION 2026

Bahagian Hal Ehwal Pembangunan Pelajar dan Alumni (BHEPA) ingin memaklumkan bahawa Kuok Foundation kini membuka permohonan Biasiswa dan Bantuan Pendidikan kepada pelajar Malaysia yang sedang menunggu kemasukan ke universiti atau sedang mengikuti pengajian sepenuh masa peringkat Ijazah Sarjana Muda di Universiti Awam Malaysia.

Pelajar yang berminat boleh mengemukakan permohonan secara dalam talian melalui portal Kuok Foundation.

Tarikh Buka Permohonan: 15 Jun 2026

Tarikh Tutup Permohonan:

• 15 Julai 2026 – Penghantaran Borang Permohonan Dalam Talian
• 22 Julai 2026 – Penghantaran Borang Permohonan Bercetak

Pautan Permohonan:
apply.kuokfoundation.org 

Sehubungan itu, semua pelajar yang memenuhi syarat kelayakan adalah digalakkan untuk memohon sebelum tarikh tutup yang ditetapkan.

(BAHASA ENGLISH)

KUOK FOUNDATION SCHOLARSHIPS AND STUDY GRANTS 2026 APPLICATION ANNOUNCEMENT

The Student Development Affairs and Alumni Division (BHEPA) wishes to inform students that the Kuok Foundation is now inviting applications for its Scholarships and Study Grants from Malaysian students who are awaiting university admission or currently pursuing a full-time Bachelor's Degree programme at Malaysian Public Universities.

Interested students are invited to submit their applications online through the Kuok Foundation application portal.

Application Opening Date: 15 June 2026

Application Closing Dates:

• 15 July 2026 – Submission of Online Application Forms
• 22 July 2026 – Submission of Printed Application Forms

Application Portal:
apply.kuokfoundation.org 

Eligible students are encouraged to submit their applications before the stated deadlines.

​📢 CAREER & EDUCATION EXPO (EKSPEN) 2026

​Missed E2K26? No worries! Here is another chance to connect with top employers, explore educational opportunities, and take a step closer to your dream career.

​🗓️ Date: 10 and 11 June 2026
⏰ Time: 10:00 AM to 4:00 PM
📍 Venue: Dewan Serbaguna Tuanku Syed Sirajuddin, USM Engineering Campus

​🚀 Meet 40+ employers actively hiring and discover career opportunities across various industries.

​💼 Explore job vacancies, industrial training placements, and educational pathways while networking directly with industry representatives and higher education institutions.

​🎤 Gain valuable insights through Career Talks and Career Coaching Sessions designed to help you navigate your future with confidence.

​🏢 Visit exhibition booths featuring companies and institutions from diverse fields, learn about industry trends, and expand your professional network.

​🎁 Don't miss the Lucky Draw and exciting activities happening throughout the event.

REGISTER HERE!
https://www.usmcareerfair.com/

​⚠️ IMPORTANT DRESS CODE NOTICE
Attendees are strictly required to dress in formal or smart casual attire. Please note that inappropriate clothing, including shorts, slippers, and sandals, is strictly prohibited. Individuals who do not comply will not be permitted entry into the exhibition hall. Let us make a great and professional impression on our participating industry partners!